基本信息:
- 专利标题： 电子装置
- 专利标题（英）：Electronic device
- 申请号：CN201410366595.2 申请日：2014-07-29
- 公开(公告)号：CN104347525A 公开(公告)日：2015-02-11
- 发明人： 山内基 , 川内治
- 申请人： 太阳诱电株式会社
- 申请人地址： 日本东京都
- 专利权人： 太阳诱电株式会社
- 当前专利权人： 太阳诱电株式会社
- 当前专利权人地址： 日本东京都
- 代理机构： 北京三友知识产权代理有限公司
- 代理人： 吕俊刚; 宋教花
- 优先权： 2013-159763 2013.07.31 JP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
The invention provides an electronic device. The electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.
公开/授权文献:
- CN104347525B 电子装置 公开/授权日：2017-06-16
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |