The present invention relates to a composite plating shielding method using separable ink, the method comprising the steps of: a circuit forming step for arranging a copper layer on top of an insulating film and forming a circuit; a PSR printing step for protecting the circuit by applying photo solder resist (PSR) ink on the upper part of a PCB on which the circuit is formed in the circuit forming step; a first gold plating step for plating, with electrolytic gold, the upper part of a substrate obtained in the PSR printing step; a dry film coating step for coating a dry film on the front surface of the substrate by applying heat and pressure to the dry film if the first gold plating step is completed; a separable ink printing step for coating separable ink with a silk screen method on the upper side of the dry film obtained in the dry film coating step; a second gold plating step for forming an anelectric gold-plating layer only on a circuit part on which the dry film and the separable ink are not coated by plating the entire surface of the substrate with electroless gold; and a dry film and separable ink exfoliating step for exfoliating the dry film and separable ink by coating amine stripper with a nozzle spraying method in order to exfoliate the dry film and separable ink at the same time. The method can prevent the discoloring of the plating due to the permeation of the second gold-plating solution into the first gold-plating region and thus can remove the fault inspection process.