基本信息:
- 专利标题： 具有导体电路的结构体及其制造方法以及热固化性树脂组合物
- 专利标题（英）：Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
- 申请号：CN201280050024.7 申请日：2012-10-09
- 公开(公告)号：CN103858527A 公开(公告)日：2014-06-11
- 发明人： 蔵渊和彦 , 藤本大辅 , 山田薰平 , 名越俊昌
- 申请人： 日立化成株式会社
- 申请人地址： 日本东京
- 专利权人： 日立化成株式会社
- 当前专利权人： 日立化成株式会社
- 当前专利权人地址： 日本东京
- 代理机构： 永新专利商标代理有限公司
- 代理人： 白丽; 陈建全
- 优先权： 2011-224341 2011.10.11 JP
- 国际申请： PCT/JP2012/076130 2012.10.09
- 国际公布： WO2013/054790 JA 2013.04.18
- 进入国家日期： 2014-04-11
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H05K3/00
This method for manufacturing a structure having a conductor circuit forms a first photo-sensitive resin layer into a pattern in a first pattern-forming step, in accordance with the shape of an opening formed on a heat-curable resin layer, whereby it is possible to provide an opening of a variety of shapes. In the method for manufacturing the structure having the conductor circuit, in addition to being possible to simultaneously form a plurality of openings, it is possible to decrease residue of the resin in the area surrounding the opening, unlike a case where an opening is formed by a laser. Therefore, even when the number of pins in a semiconductor element is increased and a need arises to provide numerous small openings, it is possible to adequately and efficiently manufacture a structure having excellent reliability.
公开/授权文献:
- CN103858527B 具有导体电路的结构体及其制造方法以及热固化性树脂组合物 公开/授权日：2018-03-09
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/46 | .多层电路的制造 |