![散热装置](/CN/2012/1/104/images/201210522010.jpg)
基本信息:
- 专利标题: 散热装置
- 专利标题(英):Cooling device
- 申请号:CN201210522010.2 申请日:2012-12-07
- 公开(公告)号:CN103857263A 公开(公告)日:2014-06-11
- 发明人: 唐振 , 周金怀
- 申请人: 富瑞精密组件(昆山)有限公司 , 鸿准精密工业股份有限公司
- 申请人地址: 江苏省苏州市昆山市开发区高科技工业园区富士康路635号
- 专利权人: 富瑞精密组件(昆山)有限公司,鸿准精密工业股份有限公司
- 当前专利权人: 安徽捷泰智能科技有限公司
- 当前专利权人地址: 江苏省苏州市昆山市开发区高科技工业园区富士康路635号
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
A cooling device comprises a cooler, a connecting piece and a fixing piece, wherein the connecting piece is used for fixing the cooler on a bearing piece; the fixing piece is used for fixing the connecting piece on the cooler; the connecting piece comprises a connecting section and an extending section; the cooler is provided with a containing hole and an installation hole communicated with the containing hole; the extending section is located on the outer side of the cooler and is used for being matched with the bearing piece; the connecting section is arranged and contained in the containing hole in a penetrating mode; the fixing piece penetrates through the installation hole and is matched with the connecting piece, and the periphery of the fixing piece abuts against the cooler, so that the connecting piece is fixed to the cooler. As the connecting section arranged in the containing hole of the cooler in the penetrating mode is fixed to the cooler through the fixing piece, the technical problems that the cost is over high due to nickel plating on the cooler and the performance of the cooler is not stable due to unfirm welding are avoided.
公开/授权文献:
- CN103857263B 散热装置 公开/授权日:2017-05-10
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
--------H05K7/20 | .便于冷却、通风或加热的改进 |