基本信息:
- 专利标题： 基板与掩模贴合夹持装置
- 专利标题（英）：Substrate and mask attachment clamp device
- 申请号：CN201210537468.5 申请日：2012-12-13
- 公开(公告)号：CN103849833A 公开(公告)日：2014-06-11
- 发明人： 杜陈忠 , 梁沐旺 , 江源远
- 申请人： 财团法人工业技术研究院
- 申请人地址： 中国台湾新竹县
- 专利权人： 财团法人工业技术研究院
- 当前专利权人： 财团法人工业技术研究院
- 当前专利权人地址： 中国台湾新竹县
- 代理机构： 中科专利商标代理有限责任公司
- 代理人： 宋焰琴
- 优先权： 101144733 2012.11.29 TW
- 主分类号： C23C14/04
- IPC分类号： C23C14/04 ; C23C16/04
A substrate and mask attachment clamp device is disclosed. The device comprises a push assembly, an upper clamp mechanism and a lower clamp mechanism. The upper clamp mechanism comprises a first inclined surface, a swing element, a second inclined surface and a sliding surface. The lower clamp mechanism comprises a lower clamp retainer and a clamp movably disposed on the lower clamp retainer. During the push assembly moving along a first direction, the push assembly moves with respect to the first inclined surface so as to drive the upper clamp mechanism to move along a second direction. The push assembly further drives the second inclined surface to move with respect to the swing element, so that the swing element drives the clamp to move along a third direction opposite to the first direction, and drives the sliding surface to move with respect to the lower clamp mechanism to drive the clamp to move along a fourth direction.