![组合印制电路板和印制电路板的制造方法](/CN/2012/1/84/images/201210422334.jpg)
基本信息:
- 专利标题: 组合印制电路板和印制电路板的制造方法
- 专利标题(英):Combined printed circuit board and method for manufacturing printed circuit board
- 申请号:CN201210422334.9 申请日:2012-10-29
- 公开(公告)号:CN103796450A 公开(公告)日:2014-05-14
- 发明人: 黄勇 , 吴会兰 , 陈正清 , 苏新虹
- 申请人: 北大方正集团有限公司 , 珠海方正科技高密电子有限公司 , 珠海方正印刷电路板发展有限公司 , 方正信息产业控股有限公司
- 申请人地址: 北京市海淀区成府路298号方正大厦9层
- 专利权人: 北大方正集团有限公司,珠海方正科技高密电子有限公司,珠海方正印刷电路板发展有限公司,方正信息产业控股有限公司
- 当前专利权人: 北大方正集团有限公司,珠海方正科技高密电子有限公司珠海方正印刷电路板发展有限公司北大方正信息产业集团有限公司
- 当前专利权人地址: 北京市海淀区成府路298号方正大厦9层
- 代理机构: 北京同达信恒知识产权代理有限公司
- 代理人: 黄志华
- 主分类号: H05K3/42
- IPC分类号: H05K3/42 ; H05K3/46
The present invention discloses a combined printed circuit board and a method for manufacturing the printed circuit board. The method for manufacturing the printed circuit board of the embodiment of the present invention comprises the steps of forming a first opening penetrating a first conductive layer and a dielectric layer at the positions at which through holes need to be formed on the first conductive layer coated with a metal plate and the dielectric layer; forming a second opening penetrating a second conductive layer at the corresponding position of the second conductive layer coated with a metal plate, wherein the first opening and the second opening at the corresponding position form a superimposed through hole, the caliber of the first opening is same as a preset aperture of the corresponding through hole and is greater than the caliber of the second opening at the corresponding position; filling a conductive paste in the superimposed through hole to obtain the combined printed circuit board. According to the combined printed circuit board manufactured by the method of the embodiment of the present invention, the caliber of the second opening is less than the caliber of the first opening, so that the residual conductive paste at the second opening can be reduced effectively, and accordingly, the manufacture cost is reduced.
公开/授权文献:
- CN103796450B 组合印制电路板和印制电路板的制造方法 公开/授权日:2016-08-03
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/40 | .用于对印刷电路或印刷电路之间提供电连接而形成印制元件 |
----------H05K3/42 | ..金属化孔 |