基本信息:
- 专利标题： 真空蒸镀用发热组合体及具备该发热组合体的真空蒸镀装置
- 专利标题（英）：Heating assembly for vacuum deposition, and vacuum deposition apparatus comprising same
- 申请号：CN201380001082.5 申请日：2013-07-23
- 公开(公告)号：CN103717780A 公开(公告)日：2014-04-09
- 发明人： 金炫中 , 金洪徹 , 全京一 , 金正来 , 黃英准
- 申请人： 株式会社世可
- 申请人地址： 韩国京畿道
- 专利权人： 株式会社世可
- 当前专利权人： 株式会社世可
- 当前专利权人地址： 韩国京畿道
- 代理机构： 北京路浩知识产权代理有限公司
- 代理人： 张晶; 王莹
- 优先权： 10-2012-0080536 2012.07.24 KR
- 国际申请： PCT/KR2013/006595 2013.07.23
- 国际公布： WO2014/017808 KO 2014.01.30
- 进入国家日期： 2013-10-18
- 主分类号： C23C14/24
- IPC分类号： C23C14/24 ; H05B3/02
Disclosed is a heating assembly for vacuum deposition, which heats a substrate carrying a deposition material in a vacuum deposition process, the heating assembly comprising a substrate-mounting unit in which the substrate is mounted, and an electrode connection unit formed at both sides of the substrate and connected to an electrode. Further, the substrate-mounting unit and/or the electrode connection unit is/are formed into the shape of a panel. The above-described heating assembly for vacuum deposition may enable the substrate carrying the deposition material to be stably mounted, and may enable the deposition material to evaporate in a specific direction in the vacuum deposition apparatus so as to thus allow the deposition material to be uniformly and efficiently deposited, even for a small amount of substrates.
公开/授权文献:
- CN103717780B 真空蒸镀用发热组合体及具备该发热组合体的真空蒸镀装置 公开/授权日：2015-10-07