基本信息:
- 专利标题： 树脂组合物、树脂清漆、预浸料、覆金属层压板及印刷线路板
- 专利标题（英）：Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
- 申请号：CN201280035322.9 申请日：2012-07-13
- 公开(公告)号：CN103717635A 公开(公告)日：2014-04-09
- 发明人： 相乐隆 , 垣内秀隆 , 柏原圭子 , 北井佑季 , 斋藤宏典 , 横山大祐 , 藤原弘明
- 申请人： 松下电器产业株式会社
- 申请人地址： 日本大阪府
- 专利权人： 松下电器产业株式会社
- 当前专利权人： 松下知识产权经营株式会社
- 当前专利权人地址： 日本大阪府
- 代理机构： 中科专利商标代理有限责任公司
- 代理人： 金仙华
- 优先权： 2011-157837 2011.07.19 JP; 2011-157838 2011.07.19 JP
- 国际申请： PCT/JP2012/004539 2012.07.13
- 国际公布： WO2013/011677 JA 2013.01.24
- 进入国家日期： 2014-01-16
- 主分类号： C08G59/62
- IPC分类号： C08G59/62 ; B32B15/08 ; C08J5/24 ; C08K5/18 ; C08K5/3445 ; C08K5/5399 ; C08L63/00 ; C08L71/12 ; H05K1/03
The purpose of the present invention is to provide a resin composition, which has excellent dielectric characteristics, while exhibiting low viscosity when obtained in a varnish form, and which has high flame retardancy and high Tg without containing a halogen, a cured product of said resin composition having excellent heat resistance. This resin composition contains: (A) a polyarylene ether copolymer having an intrinsic viscosity of 0.03-0.12 dl/g as determined in methylene chloride at 25 DEG C and having an average of 1.5-3 phenolic hydroxyl groups per molecule at an end of a molecule; (B) a triphenylmethane epoxy resin having a softening point of 50-70 DEG C; and (C) a curing accelerator. The content of the polyarylene ether copolymer (A) is 60-85 parts by mass when the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is taken as 100 parts by mass.
公开/授权文献:
- CN103717635B 树脂组合物、树脂清漆、预浸料、覆金属层压板及印刷线路板 公开/授权日：2016-01-20