The invention provides a device for testing the through-flow condition of a high-temperature superconducting strip under the bending stress. The device comprises a cylindrical epoxy body, two connecting mechanisms and a base epoxy plate, wherein the bottom part of the cylindrical epoxy body is fixed on the base epoxy plate and comprises a plurality of equal-height epoxy columns which are arranged in a laminated manner; the diameters of the epoxy columns are increased in sequence from top to bottom; the two connecting mechanisms are same in structure and comprise a main copper piece, a clamping copper piece and a fixed epoxy piece respectively; each main copper piece is provided with an access hole for communicating with external current; the bottom parts of the main copper pieces are arranged on the base epoxy plate; the fixed epoxy pieces are sheathed at the peripheries of the main copper pieces in a slidable manner, and the clamping copper pieces are clamped on the fixed epoxy pieces; the fixed epoxy pieces are provided with first fastening pieces for clamping the copper pieces in a supporting manner. The device provided by the invention has the advantages that the superconducting strip can be bent to be under the epoxy columns with different diameters, so that the continuous measurement of quenching points of the superconducting strip is realized; simultaneously, the test is simple in operating process and high in experiment accuracy.