基本信息:
- 专利标题： 用于密封地接合Cu部件的玻璃系统以及用于电子部件的壳体
- 专利标题（英）：Glass system for hermetically connecting cu components, and housing for electronic components
- 申请号：CN201280012176.8 申请日：2012-03-05
- 公开(公告)号：CN103415479A 公开(公告)日：2013-11-27
- 发明人： 罗伯特·黑特勒 , 马蒂亚斯·林特
- 申请人： 肖特公开股份有限公司
- 申请人地址： 德国美因兹
- 专利权人： 肖特公开股份有限公司
- 当前专利权人： 肖特公开股份有限公司
- 当前专利权人地址： 德国美因兹
- 代理机构： 中原信达知识产权代理有限责任公司
- 代理人： 郭国清; 穆德骏
- 优先权： 102011013278.3 2011.03.07 DE; 102011013276.7 2011.03.07 DE
- 国际申请： PCT/EP2012/000975 2012.03.05
- 国际公布： WO2012/119750 DE 2012.09.13
- 进入国家日期： 2013-09-06
- 主分类号： C03C8/20
- IPC分类号： C03C8/20 ; H01L33/48 ; H01L33/64
The invention relates to a housing for electronic components, such as LEDs and/or FETs. In general, the invention proposes the use of an alkali titanium silicate glass in order to construct the housing. Among others, this allows the construction of an extremely hermetic housing. The housing is a housing for receiving an electronic functional element, in particular an LED and/or an FET, consisting of a main part. The main part comprises an upper face, which defines a mounting region for at least one electronic functional element at least in some sections such that the main part forms a heat sink for at least one electronic functional element, and the main part also comprises a lower face and a casing. The housing also consists of at least one connecting part for at least one electronic functional element, said connecting part being connected to the main part at least by means of a glass layer, wherein the connecting glass layer is provided by an alkali titanium silicate glass.
公开/授权文献:
- CN103415479B 用于密封地接合Cu部件的玻璃系统以及用于电子部件的壳体 公开/授权日：2016-08-31
IPC结构图谱:
| C | 化学；冶金 |
| --C03 | 玻璃；矿棉或渣棉 |
| ----C03C | 玻璃、釉或搪瓷釉的化学成分；玻璃的表面处理；由玻璃、矿物或矿渣制成的纤维或细丝的表面处理；玻璃与玻璃或与其他材料的接合 |
| ------C03C8/00 | 搪瓷；釉；含有非熔块添加剂的玻璃料熔封成分 |
| --------C03C8/02 | .熔块的组成，即粉状或粒状的 |
| ----------C03C8/20 | ..含钛化合物；含锆化合物 |