
基本信息:
- 专利标题: 具有液晶聚合物焊料掩模及外封层的电子装置及相关联方法
- 专利标题(英):Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
- 申请号:CN201180064833.9 申请日:2011-12-20
- 公开(公告)号:CN103299724A 公开(公告)日:2013-09-11
- 发明人: 路易斯·约瑟夫·小伦代克 , 凯西·菲利普·罗德里古泽 , 史蒂文·R·斯奈德
- 申请人: 贺利实公司
- 申请人地址: 美国佛罗里达州
- 专利权人: 贺利实公司
- 当前专利权人: L3贺利实科技公司
- 当前专利权人地址: 美国佛罗里达州
- 代理机构: 北京律盟知识产权代理有限责任公司
- 代理人: 江葳
- 优先权: 13/007,072 2011.01.14 US
- 国际申请: PCT/US2011/066151 2011.12.20
- 国际公布: WO2012/096764 EN 2012.07.19
- 进入国家日期: 2013-07-12
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; H05K1/18 ; H05K3/28
An electronic device (10) includes a substrate (11) with a circuit layer (12) thereon that has a solder pad (13). There is a liquid crystal polymer (LCP) solder mask (16) on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component (35) is electrically coupled to the solder pad via the solder. A first dielectric layer stack (20) having a first plurality of dielectric layers is on the LCP solder mask and has an aperture (24) aligned with the solder pad. There is a first LCP outer sealing layer (23) on the first dielectric layer stack, and a second dielectric layer stack (30) having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer (33) on the second dielectric layer stack.
公开/授权文献:
- CN103299724B 具有液晶聚合物焊料掩模及外封层的电子装置及相关联方法 公开/授权日:2014-11-12
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上,而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
----------H05K3/32 | ..电元件或导线与印刷电路的电连接 |
------------H05K3/34 | ...通过焊接的 |