基本信息:
- 专利标题： 激光加工方法
- 申请号：CN201180044627.1 申请日：2011-09-09
- 公开(公告)号：CN103108722B 公开(公告)日：2015-12-02
- 发明人： 角井素贵
- 申请人： 住友电气工业株式会社
- 申请人地址： 日本大阪府
- 专利权人： 住友电气工业株式会社
- 当前专利权人： 住友电气工业株式会社
- 当前专利权人地址： 日本大阪府
- 代理机构： 北京天昊联合知识产权代理有限公司
- 代理人： 陈源; 李铭
- 优先权： 2010-206871 2010.09.15 JP; 61/385373 2010.09.22 US
- 国际申请： PCT/JP2011/070640 2011.09.09
- 国际公布： WO2012/036097 JA 2012.03.22
- 进入国家日期： 2013-03-15
- 主分类号： B23K26/36
- IPC分类号： B23K26/36 ; B23K26/362 ; B23K26/073 ; B23K26/08 ; B23K26/40 ; H01S3/00 ; H01S3/23 ; H05K3/08 ; H01L31/04
The present invention relates to a laser processing method that is capable of performing high-throughput processing by using an inexpensive pulsed laser light source. A pulsed laser light source 1 that is favorably used in this laser processing method has a seed light source, an amplifying optical fiber, a bandpass filter and the like, as well as a MOPA structure. The laser processing method is a method of processing a metal thin film formed on a transparent substrate by radiating pulsed light onto the metal thin film, and has the steps of repeatedly outputting the pulsed light by directly modulating a semiconductor laser of the seed light source in accordance with electric signals, amplifying the pulsed light using an optical amplifier including an optical amplification medium, controlling the full width at half maximum of the pulsed light that is amplified and outputted by the optical amplifier to be 0.5 ns or shorter, and removing the metal thin film by radiating the pulsed light thus having the controlled full width at half maximum onto the metal thin film through the transparent substrate.
公开/授权文献:
- CN103108722A 激光加工方法 公开/授权日：2013-05-15
IPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K26/00 | 用激光束加工，例如焊接，切割，打孔 |
| --------B23K26/36 | .除掉材料 |