基本信息:
- 专利标题： 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
- 专利标题（英）：Laminated body, laminated board, multi-layer laminated board, printed wiring board and manufacturing method for laminated board
- 申请号：CN201210357138.8 申请日：2012-09-21
- 公开(公告)号：CN103009724A 公开(公告)日：2013-04-03
- 发明人： 青岛真裕 , 高桥佳弘 , 山崎由香 , 上方康雄 , 村井曜
- 申请人： 日立化成工业株式会社
- 申请人地址： 日本东京都
- 专利权人： 日立化成工业株式会社
- 当前专利权人： 日立化成工业株式会社
- 当前专利权人地址： 日本东京都
- 代理机构： 中科专利商标代理有限责任公司
- 代理人： 蒋亭
- 优先权： 2011-207981 2011.09.22 JP; 2012-200950 2012.09.12 JP
- 主分类号： B32B17/10
- IPC分类号： B32B17/10 ; H01L23/14 ; H05K1/03 ; B32B37/10
Disclosed is a laminated body including at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a fiber-containing resin composition including a heat-curable resin and a fiber base material, and the glass substrate layer is 10-70% by volume relative to the whole laminated body. A laminated board includes at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer is a fiber-containing cured resin layer comprising a cured product of a fiber-containing resin composition including a heat-curable resin fiber base material, and the glass substrate layer is 10-70% by volume relative to the whole laminated board. A printed wiring board has the laminated board, and wiring disposed on the surface of the laminated board. A manufacturing method for the laminated board includes a fiber-containing cured resin layer-forming step in which the fiber-containing cured resin layer is formed on the surface of the glass substrate.
IPC结构图谱:
| B | 作业；运输 |
| --B32 | 层状产品 |
| ----B32B | 层状产品，即由扁平的或非扁平的薄层，例如泡沫状的、蜂窝状的薄层构成的产品 |
| ------B32B17/00 | 实质上由玻璃片或玻璃纤维、矿渣或类似物组成的层状产品 |
| --------B32B17/02 | .以纤维或细丝的形式 |
| ----------B32B17/10 | ..合成树脂的 |