The invention relates to a method for assembling a device comprising a first part (2) and at least one second part (3), said first part and said at least one second part being arranged in such a way as to be able to be assembled, characterised in that said method also comprises the following steps: the first part and the at least one second part are provided; said at least one second part and said first part are assembled according to the arrangement thereof in such a way that there is a gap (24) between said at least one second part and said first part; a selected metal alloy that is able to become at least partially amorphous is provided; said metal alloy is formed in such a way that it fills the gap between said at least one second part and said first part in order to secure same to each other and thereby form said device, said metal alloy being subjected to the treatment enabling it to become at least partially amorphous, at the latest at the time of said forming step. Said method is also characterised in that said metal alloy is subjected to an increase in temperature above its melting temperature, enabling it to locally lose any crystalline structure, said increase being followed by a cooling to a temperature lower than its glass transition temperature, enabling said material to become at least partially amorphous.