The invention discloses a manufacture method for a step circuit board with a gold-masking copper-plating hybrid surface process. The manufacture method comprises the steps of cutting materials, transferring an inner pattern, browning and pressing a plate, drilling, plating copper, electroplating the whole plate, adhering a thick gold dry film, achieving pattern transfer for the first time through exposing and developing, exposing a local electrical thick gold part, plating copper, nickel gold and electrical thick gold on the electrical thick gold part, removing the film, adhering a dry film, achieving pattern transfer for the second time through exposing and developing, exposing a part needing plating copper, plating copper, removing the film, silk-screen printing a wet film, achieving pattern transfer for the third time through exposing and developing, exposing a needed outer circuit, adhering a dry film to completely cover a PTH (Plated Through Hole) through exposing and developing, etching an outer circuit, removing the film, carrying out AOI (Automated Optical Inspection) to the outer layer, silk-screen printing and resistance-welding, lettering, forming, electrically testing, carrying out an OSP (Organic Solderability Preservatives) surface process, carrying out final inspection, packaging and shipping. The gold-masked copper-plated step circuit board manufactured by the method disclosed by the invention can achieve more compact assembling needs and a better adhering effect.