![半导体装置](/CN/2011/8/3/images/201180017302.jpg)
基本信息:
- 专利标题: 半导体装置
- 专利标题(英):Semiconductor device
- 申请号:CN201180017302.4 申请日:2011-03-30
- 公开(公告)号:CN102822977A 公开(公告)日:2012-12-12
- 发明人: 奥村启树 , 三浦峰生 , 中野佑纪 , 川本典明 , 安部英俊
- 申请人: 罗姆股份有限公司
- 申请人地址: 日本京都市
- 专利权人: 罗姆股份有限公司
- 当前专利权人: 罗姆股份有限公司
- 当前专利权人地址: 日本京都市
- 代理机构: 中国专利代理(香港)有限公司
- 代理人: 何欣亭; 王忠忠
- 优先权: 2010-078280 2010.03.30 JP
- 国际申请: PCT/JP2011/058058 2011.03.30
- 国际公布: WO2011/122670 JA 2011.10.06
- 进入国家日期: 2012-09-29
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/336
The disclosed semiconductor device contains: a semiconductor layer having a first conductivity type; a plurality of body regions that have a second conductivity type and that are formed at intervals at the surface layer of the aforementioned semiconductor layer; a source region that has the first conductivity type and that is formed at the surface layer of each of the aforementioned body regions; a gate insulating film that is provided on the aforementioned semiconductor layer and that straddles between adjacent of the aforementioned body regions; a gate electrode that is provided on the aforementioned gate insulating film and that faces the aforementioned body regions; and an electric field moderating section that is provided between adjacent of the aforementioned body regions and that moderates the electric field arising at the aforementioned gate insulating film.
公开/授权文献:
- CN102822977B 半导体装置 公开/授权日:2015-11-25
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L29/00 | 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件 |
--------H01L29/02 | .按其半导体本体的特征区分的 |
----------H01L29/68 | ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的 |
------------H01L29/70 | ...双极器件 |
--------------H01L29/762 | ....电荷转移器件 |
----------------H01L29/78 | .....由绝缘栅产生场效应的 |