
基本信息:
- 专利标题: 光电子模块
- 专利标题(英):Optoelectronic module
- 申请号:CN201080041661.9 申请日:2010-09-06
- 公开(公告)号:CN102576707A 公开(公告)日:2012-07-11
- 发明人: 沃尔特·韦格莱特 , 阿克塞尔·卡尔滕巴赫尔 , 贝恩德·巴克曼 , 卡尔·魏德纳 , 马蒂亚斯·雷布汉
- 申请人: 欧司朗光电半导体有限公司
- 申请人地址: 德国雷根斯堡
- 专利权人: 欧司朗光电半导体有限公司
- 当前专利权人: 欧司朗光电半导体有限公司
- 当前专利权人地址: 德国雷根斯堡
- 代理机构: 北京集佳知识产权代理有限公司
- 代理人: 张春水; 田军锋
- 优先权: 102009042205.6 2009.09.18 DE
- 国际申请: PCT/EP2010/063035 2010.09.06
- 国际公布: WO2011/032853 DE 2011.03.24
- 进入国家日期: 2012-03-19
- 主分类号: H01L25/075
- IPC分类号: H01L25/075 ; H01L33/44 ; H01L33/50 ; H01L33/62
The invention relates to an optoelectronic module (100) having at least one carrier (1) with at least one contact location (1A); a semiconductor chip (2) emitting radiation, wherein the semiconductor chip (2) emitting radiation comprises a first contact surface (2A) and a second contact surface (2B); an electrically insulating layer (4) comprising a first (4A) and a second recess (4B); at least one electrically conductive conductor structure (8), wherein the first contact surface (2A) is disposed on the side of the semiconductor chip (2) emitting radiation facing away from the carrier (1), the electrically insulating layer (4) is applied at least in places to the carrier (1) and the semiconductor chip (2) comprises the first recess (4A) in the area of the first contact surface (2A) and the second recess (4B) in the area of the contact location (1A), the electrically conductive conductor structure (8) is disposed on the electrically insulating layer (4) and the first contact surface (2A) electrically contacts the contact location (1A) of the carrier (1), and the electrically insulating layer (4) is formed predominately of a ceramic material.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
--------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件,例如整流二极管的组装件 |
----------H01L25/04 | ..不具有单独容器的器件 |
------------H01L25/075 | ...包含在H01L33/00组类型的器件 |