A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer, supports the semiconductor wafer when the semiconductor wafer is diced, and is structured so as to be selectively peeled off at the interface between the first adhesive layer and the bonding layer when the cut and separated semiconductor wafer (semiconductor device) is picked up. The film for a semiconductor is stacked with a semiconductor wafer, which is cut and separated by dicing, and then the adhesive forces of the obtained semiconductor device are measured. The film for a semiconductor is characterized in that when the adhesive force at the edge portion of a semiconductor device is denoted by a (N/cm) and the adhesive force at the central portion (portion other than the edge portion) of the semiconductor device is denoted by b (N/cm), the ratio a/b is 1 to 4 inclusive. Since the ratio a/b is optimized, when picking up a semiconductor device, it is possible to reliably prevent problems such as cracks, breaks, etc., of the semiconductor device caused by a high load locally applied to the semiconductor device.