基本信息:
- 专利标题： 发光器件及其发光器件封装
- 申请号：CN201110173945.X 申请日：2011-06-23
- 公开(公告)号：CN102447031B 公开(公告)日：2016-06-22
- 发明人： 丁焕熙 , 李尚烈 , 文智炯 , 金青松 , 宋俊午 , 崔光基
- 申请人： LG伊诺特有限公司
- 申请人地址： 韩国首尔
- 专利权人： LG伊诺特有限公司
- 当前专利权人： 苏州乐琻半导体有限公司
- 当前专利权人地址： 韩国首尔
- 代理机构： 中原信达知识产权代理有限责任公司
- 代理人： 夏凯; 谢丽娜
- 优先权： 10-2010-0099215 2010.10.12 KR; 10-2010-0132553 2010.12.22 KR
- 主分类号： H01L33/38
- IPC分类号： H01L33/38 ; H01L33/22 ; H01L33/00 ; H01L33/62 ; H01L33/48
A light emitting device (100) includes a light emitting structure (130) including a second conduction type semiconductor layer (132), an active layer (134), and a first conduction type semiconductor layer (136), a second electrode layer (120) arranged under the light emitting structure, a first electrode layer (115) having at least portion extending to contact with the first conduction type semiconductor layer passing the second conduction type semiconductor layer and the active layer, and an insulating layer (140) arranged between the second electrode layer and the first electrode layer, between the second conduction type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer, wherein said at least one portion of the first electrode layer contacting the first conduction type semiconductor layer has a roughness (118,119).
公开/授权文献:
- CN102447031A 发光器件及其发光器件封装 公开/授权日：2012-05-09