基本信息:
- 专利标题： 玻璃基板的研磨方法、封装件的制造方法、压电振动器、振荡器、电子设备及电波钟
- 专利标题（英）：Glass substrate polishing method, package manufacturing method, piezoelectric oscillator, oscillator, electronic device, and radio-controlled watch
- 申请号：CN200980157690.9 申请日：2009-02-25
- 公开(公告)号：CN102333736A 公开(公告)日：2012-01-25
- 发明人： 藤平洋一 , 须釜一义
- 申请人： 精工电子有限公司
- 申请人地址： 日本千叶县
- 专利权人： 精工电子有限公司
- 当前专利权人： 精工电子有限公司
- 当前专利权人地址： 日本千叶县
- 代理机构： 中国专利代理(香港)有限公司
- 代理人： 何欣亭; 朱海煜
- 国际申请： PCT/JP2009/053331 2009.02.25
- 国际公布： WO2010/097902 JA 2010.09.02
- 进入国家日期： 2011-08-25
- 主分类号： C03C19/00
- IPC分类号： C03C19/00 ; B24B37/04 ; H03H3/02
Provided is a glass substrate polishing method for polishing a glass substrate by using a polishing apparatus. This polishing apparatus comprises a surface plate for rotational drives on a first center axis, a plate made rotatable on a second center axis eccentric from the first center axis, for pushing the glass substrate toward the surface plate, and a work holder formed on the plate, for regulating the movement of the glass substrate in a surface direction while holding the glass substrate such that the center axis of the glass substrate is offset from the second center axis. The glass substrate polishing method is characterized in that said surface table is rotated, while the glass substrate is being rotatably held in the work holder, such that an abrasive is interposed between the glass substrate and the surface table, thereby to polish the glass substrate.
IPC结构图谱:
| C | 化学；冶金 |
| --C03 | 玻璃；矿棉或渣棉 |
| ----C03C | 玻璃、釉或搪瓷釉的化学成分；玻璃的表面处理；由玻璃、矿物或矿渣制成的纤维或细丝的表面处理；玻璃与玻璃或与其他材料的接合 |
| ------C03C19/00 | 用机械方法进行纤维或丝之外的玻璃表面处理 |