The invention relates to a positioning device for the electrode welding of a semiconductor laser, belonging to the technical field of semiconductor optoelectronics. The positioning device comprises a chassis (1), a base (2), a heat sink groove (3), a pulling plate (4), a handle (5), a pulling plate groove (6) and a spring (8), wherein the base (2) is fixed on the chassis (1) and provided with the heat sink groove (3) and the pulling plate groove (6); the heat sink groove (3) is communicated with the pulling plate groove (6); the pulling plate (4) is positioned in the pulling plate groove (6); the handle (5) is fixed on the pulling plate (4); and one end of the spring (8) is fixed on the base (2), and the other end of the spring (8) is fixed on the pulling plate (4). The invention has the advantages of simplifying the manual outer lead bonding technology, increasing the welding speed of an electrode lead of the high-power semiconductor laser, enhancing the finished product ratio of products and prolonging the service life of devices.