基本信息:
- 专利标题： 表面处理铜箔及镀铜层压板
- 专利标题（英）：Surface-treated copper foil and copper-clad laminate
- 申请号：CN200980135902.3 申请日：2009-07-22
- 公开(公告)号：CN102165104A 公开(公告)日：2011-08-24
- 发明人： 藤泽哲 , 铃木裕二 , 宇野岳夫
- 申请人： 古河电气工业株式会社
- 申请人地址： 日本东京
- 专利权人： 古河电气工业株式会社
- 当前专利权人： 古河电气工业株式会社
- 当前专利权人地址： 日本东京
- 代理机构： 上海专利商标事务所有限公司
- 代理人： 刘多益
- 优先权： 2008-188748 2008.07.22 JP
- 国际申请： PCT/JP2009/063095 2009.07.22
- 国际公布： WO2010/010893 JA 2010.01.28
- 进入国家日期： 2011-03-08
- 主分类号： C25D7/06
- IPC分类号： C25D7/06 ; B32B15/01 ; B32B15/088 ; H05K1/09
In order to provide a surface-treated copper foil that meets all conditions for a copper foil related to a polyimide, including adhesive strength, acid resistance, and etching properties, as well as a laminated circuit board using the surface-treated copper foil, the present invention provides either: a surface-treated copper foil composed by attaching an Ni-Zn alloy to at least one side of an untreated copper foil, wherein the Zn content (wt%) (attached amount of Zn/(attached amount of Ni + attached amount of Zn)100) is equal to or greater than 6% and equal to or less than 15% and the attached amount of Zn is 0.08 mg/dm2 or more; or a surface-treated copper foil that is a CCL composed by attaching a polyimide film to a surface-treated copper foil composed by attaching a Ni-Zn alloy to atleast one side of an untreated copper foil, wherein the Zn content (wt%) (attached amount of Zn/(attached amount of Ni + attached amount of Zn)100) in the Ni-Zn alloy attached to the surface of said metal foil of the CCL is equal to or greater than 6% and equal to or less than 15% and the attached amount of Zn is 0.08 mg/dm2 or more.
公开/授权文献:
- CN102165104B 表面处理铜箔及镀铜层压板 公开/授权日：2013-07-24
IPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D7/00 | 以施镀制品为特征的电镀 |
| --------C25D7/06 | .丝；带；箔 |