Provided is an MEMS sensor wherein especially a structure for bonding each supporting conductive section of a movable electrode section and a fixed electrode section, which are supported on a first substrate side, with a lead layer embedded in an insulating layer on the side of a second substrate which faces the first substrate with a space therebetween is improved. The MEMS sensor has a first substrate (1), a second substrate (2), and a functional layer, which is arranged between the substrates and has the movable electrode section, the fixed electrode section and the supporting conductive section. On the surface of the second substrate (2), a second insulating layer (30), a lead layer (35) and a connecting electrode section (32) which is electrically connected to the lead layer and is individually connected to each supporting conductive section are arranged. On the surface of the second insulating layer (30), a recessed section (37) which penetrates to reach even the surface of the lead layer is formed. The connecting electrode section (32) has a recessed region (32a) conforming to the shape of the recessed section (37), and a connecting region (32b) which extends long on the surface of the second insulating layer (30) from one end section in the recessed region. The supporting conductive section (17) and a connecting region (32b) of the connecting electrode section (32) arebonded to each other.