基本信息:
- 专利标题： 用于薄晶粒分离和拾取的控制与监测系统
- 专利标题（英）：Control and monitoring system for thin die detachment and pick-up
- 申请号：CN201110030866.3 申请日：2011-01-28
- 公开(公告)号：CN102148142A 公开(公告)日：2011-08-10
- 发明人： 叶少萍 , 庄智明 , 陈文炜 , 黄国威
- 申请人： 先进自动器材有限公司
- 申请人地址： 香港新界葵涌工业街16-22号屈臣氏中心20楼
- 专利权人： 先进自动器材有限公司
- 当前专利权人： 先进自动器材有限公司
- 当前专利权人地址： 香港新界葵涌工业街16-22号屈臣氏中心20楼
- 代理机构： 北京申翔知识产权代理有限公司
- 代理人： 周春发
- 优先权： 12/701,065 2010.02.05 US
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/66 ; H01L21/00
The invention discloses a method for separating the die from an adhesive tape. During detachment of the die from the adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.
公开/授权文献:
- CN102148142B 用于薄晶粒分离和拾取的控制与监测系统 公开/授权日：2013-01-02
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |