基本信息:
- 专利标题： 元件搭载用基板及其制造方法
- 专利标题（英）：Substrate for mounting element and process for its production
- 申请号：CN201010576084.5 申请日：2010-11-25
- 公开(公告)号：CN102143654A 公开(公告)日：2011-08-03
- 发明人： 中山胜寿
- 申请人： 旭硝子株式会社
- 申请人地址： 日本东京
- 专利权人： 旭硝子株式会社
- 当前专利权人： 旭硝子株式会社
- 当前专利权人地址： 日本东京
- 代理机构： 上海专利商标事务所有限公司
- 代理人： 刘多益; 胡烨
- 优先权： 2010-018925 2010.01.29 JP; 2010-203104 2010.09.10 JP
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/18 ; H05K3/26
The present invention provides a substrate for mounting element having sulfurization resistance improved by increasing planarity of the surface of a thick conductor layer. The substrate (10) for mounting element of the present invention has such a structure that on a surface of a LTCC substrate or ceramics substrate as an inorganic insulating substrate (1), a thick conductor layer (2) is formed as an element connection terminal. The thick conductor layer (2) is made of a metal composed mainly of silver (Ag) or copper (Cu) and formed by printing and firing a metal paste. This thick conductor layer has its surface planarized by wet blast treatment to a surface roughness Ra of at most 0.02 [mu]m. A Ni/Au-plated layer (3) is formed on the thick conductor layer (2), so that the surface of the thick conductor layer (2) is completely covered without any space.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/11 | ..对印刷电路或印刷电路之间提供电连接的印刷元件 |