The invention discloses a semiconductor package. The semiconductor package comprises a substrate, a conductive member, a semiconductor component, a package body and a metal layer, wherein the substrate is provided with a peripheral surface, an upper surface and a lower surface; the peripheral surface is provided with a substrate side face; the conductive member is arranged in the substrate and isprovided with a conductive member side face; the conductive member side face is exposed and is substantially flush with the substrate side face; the semiconductor component is arranged on the upper surface of the substrate and is electrically connected with the substrate; the package body is used for covering the upper surface of the substrate and the semiconductor component; the package body is provided with an outer surface which is provided with a package body side face; and the package body side face is substantially flush with the substrate side face; the metal layer is arranged on the peripheral surface of the substrate and the outer surface of the package body, is electrically connected with the conductive member and comprises an anti-electromagnetic interference metal layer and ananti-rust metal layer; and the anti-rust metal layer is used for covering the anti-electromagnetic interference metal layer.