基本信息:
- 专利标题： 保护带粘贴方法和保护带粘贴装置
- 专利标题（英）：Method for attaching protection tape and apparatus for attaching protection tape
- 申请号：CN200980101473.8 申请日：2009-10-09
- 公开(公告)号：CN101911280B 公开(公告)日：2012-07-04
- 发明人： 西尾昭德 , 木内一之 , 山本雅之 , 石井直树
- 申请人： 日东电工株式会社
- 申请人地址： 日本大阪府
- 专利权人： 日东电工株式会社
- 当前专利权人： 日东电工株式会社
- 当前专利权人地址： 日本大阪府
- 代理机构： 北京林达刘知识产权代理事务所
- 代理人： 刘新宇; 张会华
- 优先权： 2008-267723 2008.10.16 JP
- 国际申请： PCT/JP2009/005278 2009.10.09
- 国际公布： WO2010/044234 JA 2010.04.22
- 进入国家日期： 2010-06-23
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
A cooling plate having a cooling pipe meandering therein is provided in a laminated state on the rear surface of a chuck table which holds a semiconductor wafer from the rear surface by suction. The chuck table is cooled by circulating a cooling medium in the cooling pipe. The semiconductor wafer is held by suction in the state where the chuck table is cooled. Furthermore, in the state where the chuck table is cooled, a protection tape is attached to the semiconductor wafer. Namely, in the step of attaching the protection tape, the protection tape is attached to the front surface of the semiconductor wafer while the protection tape is being indirectly cooled via the semiconductor wafer cooled by being brought into direct contact with the chuck table.
公开/授权文献:
- CN101911280A 保护带粘贴方法和保护带粘贴装置 公开/授权日：2010-12-08