
基本信息:
- 专利标题: 感光性胶粘剂、半导体装置及半导体装置的制造方法
- 专利标题(英):Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
- 申请号:CN200880117162.6 申请日:2008-12-02
- 公开(公告)号:CN101868852A 公开(公告)日:2010-10-20
- 发明人: 增子崇 , 川守崇司 , 满仓一行 , 加藤木茂树
- 申请人: 日立化成工业株式会社
- 申请人地址: 日本东京都
- 专利权人: 日立化成工业株式会社
- 当前专利权人: 日立化成工业株式会社
- 当前专利权人地址: 日本东京都
- 代理机构: 中科专利商标代理有限责任公司
- 代理人: 朱丹
- 优先权: 2007-313906 2007.12.04 JP
- 国际申请: PCT/JP2008/071883 2008.12.02
- 国际公布: WO2009/072493 JA 2009.06.11
- 进入国家日期: 2010-05-20
- 主分类号: H01L21/60
- IPC分类号: H01L21/60 ; G03F7/004 ; G03F7/037
Disclosed is a method for manufacturing a semiconductor device (1). The method has a first step of arranging a photosensitive adhesive (insulating resin layer (7)) on a substrate (3) having a connecting terminal; a second step of patterning the photosensitive adhesive by exposure and development so as to form an opening (13) from which the connecting terminal is to be exposed; a third step of forming a conductive layer (9) by filling the opening (13) with a conductive material; and a fourth step of directly bonding a semiconductor chip (5) having a connecting electrode section to the photosensitive adhesive and electrically connecting the connecting terminal of the substrate (3) and the connecting electrode section of the semiconductor chip (5) to each other with the conductive layer (9) in between.
公开/授权文献:
- CN101868852B 感光性胶粘剂、半导体装置及半导体装置的制造方法 公开/授权日:2012-11-21
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
--------------H01L21/60 | ....引线或其他导电构件的连接,用于工作时向或由器件传导电流 |