The invention relates to a casting compound type CPP aluminum-base plated film. The film consists of a layer A, a layer B and a layer C which form an integral body through hot melting, co-extrusion and biaxial tension, wherein the layer A is a heat-sealing layer, the layer B is a core layer, the layer C is an aluminized layer, and each layer comprises the following raw material components in percentage by weight: 95 percent of co-polypropylene and 5 percent of anti-sticking agent for the layer A; 100 percent of homo-polypropylene for the layer B; 75 to 93 percent of the co-polypropylene, 5 to 20 percent of reinforcing agent and 2 to 5 percent of the anti-sticking agent for the layer C, wherein the reinforcing agent is an ethylene methyl acrylate copolymer WH303. Because the formula of the layer C (the aluminized layer) is added with an aluminizing reinforcing agent, the adhesion force of an aluminized aluminum layer is greatly increased to ensure that the aluminum layer cannot be peeled off when the CPP aluminized film is in casting compounding. Besides, the casting compound type CPP aluminum-base plated film can be produced on the existing production line and can be produced in bulk without changing equipment.