基本信息:
- 专利标题： 层状结构、电子器件以及显示设备
- 专利标题（英）：Laminate structure, electronic device, and display device
- 申请号：CN200880024861.6 申请日：2008-07-15
- 公开(公告)号：CN101743623A 公开(公告)日：2010-06-16
- 发明人： 田野隆德 , 小野寺敦 , 铃木幸荣 , 友野英纪
- 申请人： 株式会社理光
- 申请人地址： 日本东京都
- 专利权人： 株式会社理光
- 当前专利权人： 株式会社理光
- 当前专利权人地址： 日本东京都
- 代理机构： 北京市柳沈律师事务所
- 代理人： 王冉
- 优先权： 187630/2007 2007.07.18 JP; 187631/2007 2007.07.18 JP; 187629/2007 2007.07.18 JP
- 国际申请： PCT/JP2008/063096 2008.07.15
- 国际公布： WO2009/011445 EN 2009.01.22
- 进入国家日期： 2010-01-15
- 主分类号： H01L21/288
- IPC分类号： H01L21/288 ; H01L21/28 ; H01L21/3205 ; H01L21/336 ; H01L29/786 ; H01L51/05
A laminate structure is disclosed that has a region having high surface free energy and a region having low surface free energy that are well separated, has high adhesiveness between an underlying layer and a conductive layer, and can be formed easily with low cost. The laminate structure includes a wettability-variable layer including a first surface free energy region of a first film thickness and a second surface free energy region of a second film thickness, and a conductive layer formed on the second surface free energy region of the wettability-variable layer. The second film thickness is less than the first film thickness and the surface free energy of the second surface free energy region is made higher than the surface free energy of the first surface free energy region by applying a predetermined amount of energy on the second surface free energy region.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料 |
| --------------H01L21/26 | ....用波或粒子辐射轰击的 |
| ----------------H01L21/283 | .....用于电极的导电材料或绝缘材料的沉积 |
| ------------------H01L21/288 | ......液体的沉积，例如，电解沉积 |