![用于进行激光切割和焊接的设备](/CN/2008/8/4/images/200880022018.jpg)
基本信息:
- 专利标题: 用于进行激光切割和焊接的设备
- 专利标题(英):An apparatus for laser cutting and welding
- 申请号:CN200880022018.4 申请日:2008-06-18
- 公开(公告)号:CN101711196A 公开(公告)日:2010-05-19
- 发明人: V·辛格 , M·桑德斯
- 申请人: 通用电气医疗集团生物科学生物方法公司
- 申请人地址: 美国新泽西州
- 专利权人: 通用电气医疗集团生物科学生物方法公司
- 当前专利权人: 通用电气医疗集团生物科学生物方法公司
- 当前专利权人地址: 美国新泽西州
- 代理机构: 中国专利代理(香港)有限公司
- 代理人: 温大鹏; 杨松龄
- 优先权: 60/946,233 2007.06.26 US
- 国际申请: PCT/US2008/067306 2008.06.18
- 国际公布: WO2009/002777 EN 2008.12.31
- 进入国家日期: 2009-12-25
- 主分类号: B26D5/00
- IPC分类号: B26D5/00
A method of forming plastic containers is disclosed. The method includes: providing a support platen having a cut outline and a groove outline in the top surface of the support platen and a plurality of exhaust ports in the bottom of the groove, where a plurality of spaced perforations are in the top surface of the support platen, where the groove is configured to define a cut outline; positioning a first film on the top surface of the support platen; providing a laser to cut the first film along the cut outline of the top surface of the support platen; providing a second film on top of the first film; connecting the plurality of exhaust ports and the plurality of space perforations to a vacuum source to secure the first film to the support platen; directing a jet of gas onto the second film at the to maintain the second sheet in contact with the first sheet at a seam during welding concentric with a beam from the laser to weld the first film and the second film; moving the laser and the support platen relative to each other to weld the first film and the second film along a seam outline; and providing the laser to cut the first film and the second film along the cut outline to provide a trimmed bag.
公开/授权文献:
- CN101711196B 用于进行激光切割和焊接的设备 公开/授权日:2012-03-21
IPC结构图谱:
B | 作业;运输 |
--B26 | 手动切割工具;切割;切断 |
----B26D | 切割;用于切断,例如切割、打孔、冲孔、冲裁的机器的通用零件 |
------B26D5/00 | 用于切割、切下、冲裁、冲孔、打孔或用除切割以外的方法切断的机器或设备的操作和控制装置 |