基本信息:
- 专利标题： 厚膜BGA防硫化工艺方法
- 专利标题（英）：Anti-vulcanization process method for thick-film BGA
- 申请号：CN200910218777.4 申请日：2009-11-03
- 公开(公告)号：CN101699618A 公开(公告)日：2010-04-28
- 发明人： 韩晴 , 毛利 , 张红娟 , 贺敏 , 罗菊彬 , 曹庆
- 申请人： 陕西华经微电子股份有限公司
- 申请人地址： 陕西省西安市电子城电子西街三号
- 专利权人： 陕西华经微电子股份有限公司
- 当前专利权人： 陕西华经微电子股份有限公司
- 当前专利权人地址： 陕西省西安市电子城电子西街三号
- 代理机构： 西安文盛专利代理有限公司
- 代理人： 佘文英
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L27/01
The invention provides an anti-vulcanization process method for a thick-film BGA, which comprises the steps of: printing a conductor and a resistor on a ceramic substrate first, and then printing protective glass on the conductor, wherein the protective glass after molding exactly covers the edge of a conductor layer; designing a screen opening of printing solder paste, and making the printing solder paste completely cover an exposed conductor pad; and planting balls on a thick-film chip printed with the solder paste, making the solder paste completely cover the exposed conductor during the ball plantation, and finally finishing the welding through hot air reflow soldering. When various layers of films are printed, the printing pressure is between 2.5 and 6.5Kg, and the leveling time is between 5 and 10 minutes. The process method not only can meet the design requirement of basic performance, but also has good anti-vulcanizing protective measures, and improves the reliability of products.
公开/授权文献:
- CN101699618B 厚膜BGA防硫化工艺方法 公开/授权日：2012-01-04