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基本信息:
- 专利标题: 微小型装配体整体一次成型制作方法
- 专利标题(英):Manufacture method of integrally molding miniature assembly body
- 申请号:CN200910035952.6 申请日:2009-09-28
- 公开(公告)号:CN101693516A 公开(公告)日:2010-04-14
- 发明人: 杨继全 , 朱玉芳 , 彭晨 , 岳东
- 申请人: 南京师范大学
- 申请人地址: 江苏省南京市宁海路122号
- 专利权人: 南京师范大学
- 当前专利权人: 南京师范大学
- 当前专利权人地址: 江苏省南京市宁海路122号
- 代理机构: 南京知识律师事务所
- 代理人: 程化铭
- 主分类号: B81C99/00
- IPC分类号: B81C99/00
The invention discloses a manufacture method of integrally molding a miniature assembly body, which comprises the following steps: coloring a CAD model according to material distribution characteristics of the three-dimensional CAD model of the miniature assembly body; carrying out discrete slicing lamination on the three-dimensional CAD model of the miniature assembly body to obtain a series of two-dimensional slices including molding material information and structure information; spraying molding materials layer by layer according to the structure information of the two-dimensional slices; spraying supporting materials to regions which are not sprayed by the molding materials in all layers for filling, rapidly solidifying or cooling accumulated entity materials and supporting materials to mold; and adhering and overlapping layer by layer, removing the supporting materials filled in each layer after the molding is finished to obtain the miniature assembly body corresponding to an entity model of a computer. The miniature assembly body is molded once without an assembly procedure, therefore, the method has simple procedure, low manufacture cost, broad material selection range and high manufacture precision of the miniature assembly body.
IPC结构图谱:
B | 作业;运输 |
--B81 | 微观结构技术 |
----B81C | 专门适用于制造或处理微观结构的装置或系统的方法或设备 |
------B81C99/00 | 本小类其他各组中不包括的技术主题 |