
基本信息:
- 专利标题: 一种实现电镀漂洗水在线回用的方法及装置
- 专利标题(英):Method and device for realizing on-line recycle of electroplating rinse water
- 申请号:CN200910111638.1 申请日:2009-04-30
- 公开(公告)号:CN101545131A 公开(公告)日:2009-09-30
- 发明人: 李清彪 , 苏远波 , 王远鹏 , 王海涛 , 洪金庆
- 申请人: 厦门大学
- 申请人地址: 福建省厦门市思明南路422号
- 专利权人: 厦门大学
- 当前专利权人: 厦门大学
- 当前专利权人地址: 福建省厦门市思明南路422号
- 代理机构: 厦门南强之路专利事务所
- 代理人: 陈永秀; 马应森
- 主分类号: C25D21/20
- IPC分类号: C25D21/20
The invention provides a method and a device for realize on-line recycle of electroplating rinse water, relates to a method and a device for electroplating wastewater treatment. The method adopts a stuffing evaporator as an evaporation concentration device for an electroplating solution, utilizes the device to efficiently evaporate and concentrate the electroplating solution on line during circulation and filtration of the electroplating solution, and directly supplements and recycles the electroplating rinse water to make the liquid level of the electroplating solution stabilized to a certain level and realize the on-line recycle of the electroplating rinse water as well as realize normal electroplating production at the same time. The device is arranged above an electroplating bath, and consists of the stuffing evaporator and an exhaust fan; the stuffing evaporator comprises a pressure plate, a stuffing, a support frame body, a grid plate and a sprayer; the support frame body is of a frame body, the top and the periphery of the support frame body are sealed, the bottom of the support frame body is opened, and the top of the support frame body is provided with an air extractor connector and an electroplating solution inlet pipe; the grid plate is fixed on the bottom of the support frame body, the stuffing is placed above the grid plate, the pressure plate is additionally arranged on the stuffing, the sprayer is fixed on the top of the support frame body, and a water inlet of the sprayer is connected with a filter in the electroplating device; and the exhaust fan is connected with the air extractor connector on the top of the support frame body.
IPC结构图谱:
C | 化学;冶金 |
--C25 | 电解或电泳工艺;其所用设备 |
----C25D | 覆层的电解或电泳生产工艺方法;电铸;工件的电解法接合;所用的装置 |
------C25D21/00 | 电解镀覆用电解槽的维护或操作方法 |
--------C25D21/12 | .工艺控制或调节 |
----------C25D21/20 | ..漂洗液的 |