The present invention relates to a microwave chip supporting structure (1, 1', 1'', 1''') comprising a first microwave laminate layer (2, 49), with a first side (3, 50) and a second side (4, 51), and an outer limit (6, 7, 8, 9; 53, 54, 55, 56). At least one conductor (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65) is formed on said first side (3, 50), extending towards said outer limit (6, 7, 8, 9; 53, 54, 55, 56). The microwave chip supporting structure (1, 1', 1'', 1''') further comprises a second microwave laminate layer (33, 33'; 57), with a first side (34, 58) and a second side (35, 59), the second side (35, 59) of the second laminate layer (33, 33', 57) being fixed to at least a part of the first side (3, 50) of the first laminate layer (2, 49). The first laminate layer (2, 49) and/or the second laminate layer (33, 33'; 57) comprises at least one recess (10, 36, 66) arranged for receiving a microwave chip (11, 67) intended to be connected to said conductor (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65). The second laminate layer (33, 57) extends outside the outer limit (6, 7, 8, 9; 53, 54, 55, 56) of the first laminate layer (2, 49), said conductors (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65) continuing on the second side (35, 59) of the second laminate layer (33, 57) without contacting the first laminate layer (2, 49).