基本信息:
- 专利标题： 增强型电子键合引线封装
- 专利标题（英）：Electrically enhanced wirebond package
- 申请号：CN200780010424.4 申请日：2007-03-23
- 公开(公告)号：CN101410974A 公开(公告)日：2009-04-15
- 发明人： 克里斯·怀兰德
- 申请人： NXP股份有限公司
- 申请人地址： 荷兰艾恩德霍芬
- 专利权人： NXP股份有限公司
- 当前专利权人： 台湾积体电路制造股份有限公司,申请人
- 当前专利权人地址： 荷兰艾恩德霍芬
- 代理机构： 中科专利商标代理有限责任公司
- 代理人： 朱进桂
- 优先权： 60/785,908 2006.03.23 US
- 国际申请： PCT/IB2007/050997 2007.03.23
- 国际公布： WO2007/107964 EN 2007.09.27
- 进入国家日期： 2008-09-23
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L21/60
Consistent with an example embodiment, there is an integrated circuit (IC) device in a packaging having electrically insulated connections. The IC device comprises a semiconductor device (100) mounted onto a die attachment area (10); the semiconductor device has a plurality of bonding pads (20a, 25a, 30a, 35a). A lead frame having a plurality of bonding fingers (20b, 25b, 30b, 35b) surrounds the die attachment area. A plurality of mutually isolated connection conductors (25d, 30d, 40, 50) having respective first ends are attached to respective bonding pads on the semiconductor device and the plurality of mutually isolated connection conductors having respective second respective second ends are attached to respective bonding fingers of the lead frame. An insulating material (45) coats at least a portion of the plurality of mutually isolated connection conductors. The mutually isolated connection conductors may include a bond wire (40,50) for the signal connection and a conductive strap (25d,30d) for the voltage reference connection. The insulating material (45) coating the bond wires reduces the likelihood of short circuits during encapsulation.
公开/授权文献:
- CN101410974B 增强型电子键合引线封装 公开/授权日：2013-02-20
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
| ------------H01L23/49 | ...类似线状的 |