A package structure stacked with a plurality of chips comprises a lead frame, a first chip and a second chip, wherein the lead frame is formed by a plurality of inner pins and a plurality of outer pins, and the inner pin comprises a plurality of parallel first inner pin groups and a plurality of parallel second inner pin groups, and the first inner pin groups are oppositely arrayed with the tail ends of the second inner pin groups in an interval. A plurality of metal bonding pads are arranged on the active surface of the first chip close to the center region, and are fixed on the lower surfaces of the first inner pin groups and the second inner pin groups through a first adhesive coating, and some metal bonding pads are exposed, a second adhesive coating is formed on the back of the second chip, and the second chip is fixed on the upper surfaces of the first inner pin groups and the second inner pin groups through the second adhesive coating, and a metal wire for connecting the first chip is disconnected with the back of the second chip through the space formed by the thickness of the second adhesive coating.