基本信息:
- 专利标题： 用于压敏胶粘剂层的光固化组合物和用其制备的切割胶带
- 专利标题（英）：Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same
- 申请号：CN200810146783.9 申请日：2008-08-29
- 公开(公告)号：CN101376797B 公开(公告)日：2011-05-18
- 发明人： 黄龙河 , 丁畅范 , 宋圭锡 , 朴白晟 , 崔承执 , 河京珍
- 申请人： 第一毛织株式会社
- 申请人地址： 韩国庆尚北道龟尾市
- 专利权人： 第一毛织株式会社
- 当前专利权人： 第一毛织株式会社
- 当前专利权人地址： 韩国庆尚北道龟尾市
- 代理机构： 北京三幸商标专利事务所
- 代理人： 刘激扬
- 优先权： 10-2007-0088323 2007.08.31 KR
- 主分类号： C09J133/00
- IPC分类号： C09J133/00 ; C09J7/02
The present invention discloses a photocurable composition used for forming pressure sensitive adhesive layer. The photocurable composition comprises pressure sensitive adhesive binder, reactive acrylate, thermal curing agent and phtoinitiator. The pressure sensitive adhesive binder is composed of pressure sensitive adhesive polymer resin and low molecular weight acrylate which comprises carbon-carbon double bond and is led into side chain of pressure sensitive adhesive resin. The reactive acrylate comprises dimethyl cyclosiloxane unit in molecular chain. The invention also discloses a cutting rubber belt which comprises a pressure sensitive adhesive layer formed by the photocurable composition. When a thin wafer is installed on cutting rubber belt, cut and radiated by UV, no connection occurs. Therefore the maximum peeling strength between the pressure sensitive adhesive layer and thin wafer is quite low, and the collecting capability of thin wafer is excellent.
公开/授权文献:
- CN101376797A 用于压敏胶粘剂层的光固化组合物和用其制备的切割胶带 公开/授权日：2009-03-04