The invention belongs to the alloy material technical field and provides a preparation technology method for a dispersion copper matrix vacuum switch contact composite material. The method adopts Cu-Al alloy powder with low solid solubility, the aluminum content of the Cu-Al alloy powder is not more than 1.00 wt percent, the balance is Cu, pure chromium metal powder and industrial Cu2O are taken as raw materials, wherein, the mixing proportion of the Cu-Al alloy powder and the oxidant Cu2O is (94-96)wt percent: (6-4)wt percent, and the mixing proportion of the total amount of the Cu-Al alloy powder and the oxidant Cu2O as well as Cr powder is (75-50)wt percent: (25-50)wt percent; the preparation technology comprises alloy melting, powder preparation, powder mixing, pressing, internal oxidation as well as hot extrusion and cold drawing molding; wherein, the inner oxidation and sintering are synchronously carried out, the sintering temperature is between 900 and 1050 DEG C, and the sintering time is between 4 and 10 hours; the obtained dispersion copper matrix vacuum switch contact composite material mainly comprises a dispersion copper matrix Cu-Al2O3 and Cr particles, the content of the Cu-Al2O3 is less than or equal to 1.50 wt percent, the diameters of particles are not more than 100nm, and the Cr content is between 25 and 50 wt percent.