![多层涂层及使用该多层涂层的器件和方法](/CN/2007/1/33/images/200710167221.jpg)
基本信息:
- 专利标题: 多层涂层及使用该多层涂层的器件和方法
- 专利标题(英):Multilayer coating, device and method for using the multilayer coating
- 申请号:CN200710167221.8 申请日:2003-04-14
- 公开(公告)号:CN101231974B 公开(公告)日:2010-06-02
- 发明人: J·C·帕加诺 , K·J·内尔森 , P·E·伯罗斯 , M·E·格罗斯 , M·R·祖姆霍夫 , P·M·马丁 , C·C·邦哈姆 , G·L·格拉夫
- 申请人: 维特克斯系统公司
- 申请人地址: 美国加利福尼亚州
- 专利权人: 维特克斯系统公司
- 当前专利权人: 三星显示有限公司
- 当前专利权人地址: 美国加利福尼亚州
- 代理机构: 中国专利代理(香港)有限公司
- 代理人: 吕彩霞; 韦欣华
- 优先权: 60/372559 2002.04.15 US; 10/412133 2003.04.11 US
- 分案原申请号: 03808497X 2003.04.14
- 主分类号: H01L23/28
- IPC分类号: H01L23/28 ; H01L23/29 ; H01L23/31 ; H01L21/56 ; H01L51/00 ; H01L51/52 ; H01L51/54 ; H01L51/56
A tool for depositing multilayer coatings onto a substrate. The tool includes a housing defining a vacuum chamber connected to a vacuum source, deposition stations each configured to deposit a layer of multilayer coating on the substrate, a curing station, and a contamination reduction device. At least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. In one tool configuration, the substrate may travel back and forth through the tool as many times as needed to achieve the desired number of layers of multilayer coating. In another, the tool may include numerous housings adjacently spaced such that the substrate may make a single unidirectional pass. The contamination reduction device may be configured as one or more migration control chambers about at least one of the deposition stations, and further includes cooling devices, such as chillers, to reduce the presence of vaporous layer precursors. The tool is particularly well-suited to depositing multilayer coatings onto flexible substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.
公开/授权文献:
- CN101231974A 在离散片上沉积多层涂层的装置 公开/授权日:2008-07-30
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/28 | .封装,例如密封层、涂覆物 |