基本信息:
- 专利标题： 导电性膏和电路基板以及电路部件及其制造方法
- 专利标题（英）：Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
- 申请号：CN200680006873.7 申请日：2006-04-04
- 公开(公告)号：CN101133462A 公开(公告)日：2008-02-27
- 发明人： 今堀诚 , 中谷隆 , 秋田雅典 , 野上高正 , 多贺井照郎
- 申请人： 东亚合成株式会社 , 东丽工程株式会社 , 协立化学产业株式会社
- 申请人地址： 日本东京
- 专利权人： 东亚合成株式会社,东丽工程株式会社,协立化学产业株式会社
- 当前专利权人： 东亚合成株式会社,东丽工程株式会社,协立化学产业株式会社
- 当前专利权人地址： 日本东京
- 代理机构： 中国国际贸易促进委员会专利商标事务所
- 代理人： 王以平
- 优先权： 110369/2005 2005.04.06 JP
- 国际申请： PCT/JP2006/307133 2006.04.04
- 国际公布： WO2006/109627 JA 2006.10.19
- 进入国家日期： 2007-09-03
- 主分类号： H01B1/22
- IPC分类号： H01B1/22 ; G06K19/077 ; H01B1/00 ; H01L21/60 ; H05K1/09
The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 mum or more and 10 mum or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board (1') is provided with a substrate (11) and an electrode (12) formed at least on one side of the substrate (11) using the above conductive paste. On the surface of the electrode (12), an adhesive insulating area composed of a composition having a storage modulus at 25° C. smaller than that of the resin constituting the conductive paste may be provided.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01B | 电缆；导体；绝缘体；导电、绝缘或介电材料的选择 |
| ------H01B1/00 | 按导电材料特性区分的导体或导电物体；用作导体的材料选择 |
| --------H01B1/06 | .主要由其他非金属物质组成的 |
| ----------H01B1/22 | ..包含金属或合金的导电材料 |