基本信息:
- 专利标题： 结合IC整合基板与载板的结构及其与电子装置的制造方法
- 专利标题（英）：Structure combining IC integration base board and carrier board and its manufacturing method for electronic device
- 申请号：CN200610115529.3 申请日：2006-08-18
- 公开(公告)号：CN101127330A 公开(公告)日：2008-02-20
- 发明人： 杨之光
- 申请人： 巨擘科技股份有限公司
- 申请人地址： 中国台湾新竹市
- 专利权人： 巨擘科技股份有限公司
- 当前专利权人： 巨擘科技股份有限公司
- 当前专利权人地址： 中国台湾新竹市
- 代理机构： 上海翼胜专利商标事务所
- 代理人： 翟羽
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/14 ; H01L23/538 ; H01L21/00 ; H01L21/48 ; H05K3/00 ; H05K1/00
The utility model provides a structure which combines an IC integrated substrate and a support plate, and comprises a support plate and an IC integrated substrate, wherein the IC integrated substrate is arranged on the support plate and has a primary dielectric layer jointed with the support plate; the materials of the support plate and the primary dielectric layer are chosen in order to prevent the IC integrated substrate from falling off the support plate by the help of the adhesive attraction between the support plate and the primary dielectric layer; when cutting at last, the cut IC integrated substrate can separate from the support plate naturally. The utility model also provides the manufacturing approach of the above structure and the manufacturing approach of the electronic device.
公开/授权文献:
- CN100485909C 结合IC整合基板与载板的结构及其与电子装置的制造方法 公开/授权日：2009-05-06
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |