A procedure is disclosed for modifying the topography of the surface of a polymer substrate to improve the bonding capability of the surface of the polymer in respect to subsequently applied coatings such as metal films, paints and inks. The procedure involved comprises first laminating a sacrificial, anodized metal foil to the substrate surface by heat and pressure, chemically stripping away that foil and then developing preferably, by a supplemental chemical stripping treatment, a network of microscopic fissures and cracks which is believed to incipiently form in the surface by the laminating process. Thereafter the treated substrate may be activated and electrolessly plated by conventional methods, followed by an added electrolytic or electroless plating if desired, to provide a metal film of execellent adhesion. Alternatively, standard vacuum metallizing procedures may be used to provide the initial or finished metal coating. Adhesion of other, nonmetallic, coatings such as paints and inks is also improved by the process.